Seung Ho Shin

According to our database, Seung Ho Shin authored at least 16 papers between 2021 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

A Novel CNN-Based Redundancy Analysis Using Parallel Solution Decision.

Seung Ho Shin, Minho Cheong, Hayoung Lee, Byungsoo Kim, Sungho Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2025

A Built-In Self-Repair With Maximum Fault Collection and Fast Analysis Method for HBM.

Joonsik Yoon, Hayoung Lee, Youngki Moon, Seung Ho Shin, Sungho Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2025

Effective Parallel Redundancy Analysis Using GPU for Memory Repair.

Seung Ho Shin, Hayoung Lee, Sungho Kang

IEEE Trans. Very Large Scale Integr. Syst., February, 2025

A Novel Prediction-Based Two-Tiered ECC for Mitigating SWD Errors in HBM.

Youngki Moon, Seung Ho Shin, Seokjun Jang, Duyeon Won, Sungho Kang

IEEE Trans. Very Large Scale Integr. Syst., February, 2025

RAPID: Redundancy Analysis With Parallelized and Intelligent Distribution.

Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang

IEEE Access, 2025

2024

GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults.

Seung Ho Shin, Hayoung Lee, Sungho Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2024

Effective Data-Width Aware ECC Scheme for HBM.

Seung Ho Shin, Youngki Moon, Byungsoo Kim, Sungho Kang

Proceedings of the 21st International SoC Design Conference, 2024

2023

TRUST: Through-Silicon via Repair Using Switch Matrix Topology.

Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair.

Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang

Proceedings of the 20th International SoC Design Conference, 2023

Redundancy Analysis Simplification Scheme for High-Speed Memory Repair.

Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 20th International SoC Design Conference, 2023

2022

ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM.

Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

IEEE Trans. Very Large Scale Integr. Syst., 2022

An Improved Early Termination Methodology Using Convolutional Neural Network.

Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

FAME: Fault Address Memory Structure for Repair Time Reduction.

Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

PROG: Per-Row Output Generator for BOST.

Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

2021

Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory.

Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang

Proceedings of the 18th International SoC Design Conference, 2021

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA.

Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang

Proceedings of the 18th International SoC Design Conference, 2021