Seung Ho Shin

According to our database, Seung Ho Shin authored at least 9 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

TRUST: Through-Silicon via Repair Using Switch Matrix Topology.

Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair.

Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang

Proceedings of the 20th International SoC Design Conference, 2023

Redundancy Analysis Simplification Scheme for High-Speed Memory Repair.

Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 20th International SoC Design Conference, 2023

2022

ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM.

Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

IEEE Trans. Very Large Scale Integr. Syst., 2022

An Improved Early Termination Methodology Using Convolutional Neural Network.

Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

FAME: Fault Address Memory Structure for Repair Time Reduction.

Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

PROG: Per-Row Output Generator for BOST.

Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang

Proceedings of the 19th International SoC Design Conference, 2022

2021

Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory.

Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang

Proceedings of the 18th International SoC Design Conference, 2021

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA.

Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang

Proceedings of the 18th International SoC Design Conference, 2021