Harold Philipsen

According to our database1, Harold Philipsen authored at least 4 papers between 2009 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2015
Impact of oxide liner properties on TSV Cu pumping and TSV stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2011
Low temperature through-Si via fabrication using electroless deposition.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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