According to our database1, Harold Philipsen authored at least 4 papers between 2009 and 2015.
Legend:Book In proceedings Article PhD thesis Other
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009