Shunji Kurooka

According to our database1, Shunji Kurooka authored at least 2 papers between 2015 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2019
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015
Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015


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