Yoshinori Hotta

According to our database, Yoshinori Hotta authored at least 2 papers between 2015 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration.

Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.

Kosuke Yamashita, Shunji Kurooka, Koji Shirakawa, Yoshinori Hotta, Hirofumi Abe

Proceedings of the 2015 International 3D Systems Integration Conference, 2015