Ai Nakamura

According to our database, Ai Nakamura authored at least 6 papers between 2014 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Relationship between Metacarpophalangeal Joint Angle and Muscle Activity of Healthy Persons while Using the Finger Extensor Facilitation Training Device "iPARKO".

Ai Nakamura, Shota Ishigaki, Yoshifumi Morita, Hirofumi Tanabe

Proceedings of the International Conference on Rehabilitation Robotics, 2022

2019

Co-PoeTryMe: Interactive poetry generation.

Hugo Gonçalo Oliveira, Tiago Mendes, Ana Boavida, Ai Nakamura, Margareta Ackerman

Cogn. Syst. Res., 2019

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration.

Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.

Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.

K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014