Siau Ben Chiah

According to our database, Siau Ben Chiah authored at least 8 papers between 2013 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Scalable Compact Model for High-frequency GaN-HEMTs.

Xing Zhou, Siau Ben Chiah

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2021

Enabling Monolithic Heterogeneously Integrated Si/III-V Technology Platform.

Siau Ben Chiah, Xing Zhou, Kenneth Eng-Kian Lee

Proceedings of the 14th IEEE International Conference on ASIC, 2021

2019

Monolithic Co-integration of III-V Materials into Foundry Si-CMOS in a Single Chip for Novel Integrated Circuits.

Xing Zhou, Siau Ben Chiah, Binit Syamal, Kenneth Eng-Kian Lee

Proceedings of the 13th IEEE International Conference on ASIC, 2019

2017

Automatic place-and-route of emerging LED-driven wires within a monolithically-integrated CMOS-III-V process.

Tushar Krishna, Arya Balachandran, Siau Ben Chiah, Li Zhang, Bing Wang, Cong Wang, Kenneth Eng-Kian Lee, Jürgen Michel, Li-Shiuan Peh

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2017

2016

An on-chip integrated III-V / CMOS 125MSps 6-bit SAR ADC.

Sunny Sharma, Siau Ben Chiah, Xing Zhou, Chirn Chye Boon

Proceedings of the International Symposium on Integrated Circuits, 2016

Effect of metal work function on the DC characteristics of an asymmetric MOSFET with Schottky-based source.

Arjun Ajaykumar, Xing Zhou, Siau Ben Chiah

Proceedings of the International Symposium on Integrated Circuits, 2016

2014

Compact Fermi potential model for heterostructure HEMTs with rectangular quantum well.

Arjun Ajaykumar, Xing Zhou, Binit Syamal, Siau Ben Chiah

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Top-down drift-diffusion versus bottom-up quasi-ballistic formalism in device compact modeling.

Xing Zhou, Junbin Zhang, Binit Syamal, Zhaomin Zhu, Hongtao Zhou, Siau Ben Chiah

Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013