Takeki Ninomiya

According to our database, Takeki Ninomiya authored at least 4 papers between 2013 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

High Thermal Conductivity AlN Films for Advanced 3D Chiplets.

Takeshi Takagi, Takeki Ninomiya, Masaaki Niwa, Soken Obara, Takeshi Momose, Yukihiro Shimogaki, Masahiro Nomura, Hiroshi Fujioka, Masakazu Mori, Tadahiro Kuroda

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2015

Theoretical and Experimental Approaches to Select Resistive Switching Material.

Takeki Ninomiya, Zhiqiang Wei, Shinichi Yoneda, Kenji Shiraishi

IEICE Trans. Electron., 2015

2014

Quantitative method for estimating characteristics of conductive filament in ReRAM.

Zhiqiang Wei, Ryutaro Yasuhara, Koji Katayama, Takumi Mikawa, Takeki Ninomiya, Shunsaku Muraoka

Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014

2013

Filament scaling forming technique and level-verify-write scheme with endurance over 107 cycles in ReRAM.

Akifumi Kawahara, Ken Kawai, Yuuichirou Ikeda, Yoshikazu Katoh, Ryotaro Azuma, Yuhei Yoshimoto, Kouhei Tanabe, Zhiqiang Wei, Takeki Ninomiya, Koji Katayama, Ryutaro Yasuhara, Shunsaku Muraoka, Atsushi Himeno, Naoki Yoshikawa, Hideaki Murase, Kazuhiko Shimakawa, Takeshi Takagi, Takumi Mikawa, Kunitoshi Aono

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013