Thorben Casper

According to our database, Thorben Casper authored at least 9 papers between 2016 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging.

Thorben Casper, Ulrich Römer, Herbert De Gersem, Sebastian Schöps

Comput. Math. Appl., 2020

2019

3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.

Katrin Hirmer, Thorben Casper, Sebastian Schöps, Klaus Hofmann

CoRR, 2019

2018

Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.

Alexander Krimm, Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ludovic Chamoin

CoRR, 2018

Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.

Thorben Casper, David Duque, Sebastian Schöps, Herbert De Gersem

CoRR, 2018

Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.

Steve Bigalke, Jens Lienig, Thorben Casper, Sebastian Schöps

Proceedings of the 14th Conference on Ph.D. Research in Microelectronics and Electronics, 2018

2016

High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.

Dimitrios Loukrezis, Ulrich Römer, Thorben Casper, Sebastian Schöps, Herbert De Gersem

CoRR, 2016

Determination of Bond Wire Failure Probabilities in Microelectronic Packages.

Thorben Casper, Ulrich Römer, Sebastian Schöps

CoRR, 2016

Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.

Thorben Casper, Herbert De Gersem, Sebastian Schöps

CoRR, 2016

Electrothermal simulation of bonding wire degradation under uncertain geometries.

Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps

Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016