Tianshuo Bai

According to our database, Tianshuo Bai authored at least 4 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

HyIMC: Analog-Digital Hybrid In-Memory Computing SoC for High-Quality Low-Latency Speech Enhancement.

Wanru Mao, Hanjie Liu, Guangyao Wang, Tianshuo Bai, Jingcheng Gu, Han Zhang, Xitong Yang, Aifei Zhang, Xiaohang Wei, Meng Wang, Wang Kang

Proceedings of the Design, Automation & Test in Europe Conference, 2025

2024

An End-to-End In-Memory Computing System Based on a 40-nm eFlash-Based IMC SoC: Circuits, Toolchains, and Systems Co-Design Framework.

Tianshuo Bai, Wanru Mao, Guangyao Wang, Hanjie Liu, Aifei Zhang, Shihang Fu, Shuaikai Liu, Jianchao Hu, Xitong Yang, Biao Pan, Wei W. Xing, Wang Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024

2023

A Survey of MRAM-Centric Computing: From Near Memory to In Memory.

Yueting Li, Tianshuo Bai, Xinyi Xu, Yundong Zhang, Bi Wu, Hao Cai, Biao Pan, Weisheng Zhao

IEEE Trans. Emerg. Top. Comput., 2023

A 40nm 5-16Tops/W@INT8 eFlash In-Memory Computing SoC Chip with Noise Suppression and Compensation Techniques to Improve the Accuracy.

Guanavao Wang, Yuexi Lv, Yu Tian, Jian Zhang, Carol Guo, Tianshuo Bai, Biao Pan, Derek Wang, Wang Kang

Proceedings of the IEEE International Conference on Integrated Circuits, 2023