Tianshuo Bai
Orcid: 0000-0002-3966-1442
According to our database1,
Tianshuo Bai authored at least 8 papers
between 2023 and 2026.
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Bibliography
2026
HyIMC: A 16 TOPS/W Hybrid Analog-Digital In-Memory Computing SoC With Model Compression and Recurrent Optimization for Deep Learning-Based Speech Enhancement.
IEEE J. Emerg. Sel. Topics Circuits Syst., June, 2026
An Operator-Circuit Co-design Digital SOT-MRAM Computing-in-Memory Accelerator with Double Bit Density and Full-Utilized Bandwidth/Throughput.
Proceedings of the Design, Automation & Test in Europe Conference, 2026
2025
TongueBCI: An Interaction Method Based on EEG Signals from Tongue Movement Direction.
Proceedings of the Extended Reality - International Conference, 2025
PAR-CIM: A Precise/Approximate Reconfigurable Digital CIM Macro with 0.35-4b Fractional Mixed-Bitwidth Quantization.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025
HyIMC: Analog-Digital Hybrid In-Memory Computing SoC for High-Quality Low-Latency Speech Enhancement.
Proceedings of the Design, Automation & Test in Europe Conference, 2025
2024
An End-to-End In-Memory Computing System Based on a 40-nm eFlash-Based IMC SoC: Circuits, Toolchains, and Systems Co-Design Framework.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024
2023
IEEE Trans. Emerg. Top. Comput., 2023
A 40nm 5-16Tops/W@INT8 eFlash In-Memory Computing SoC Chip with Noise Suppression and Compensation Techniques to Improve the Accuracy.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023