Tianxiang Zhu

According to our database, Tianxiang Zhu authored at least 11 papers between 2023 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

AcademiClaw: When Students Set Challenges for AI Agents.

Junjie Yu, Pengrui Lu, Weiye Si, Hongliang Lu, Jiabao Wu, Kaiwen Tao, Kun Wang, Lingyu Yang, Qiran Zhang, Xiuting Guo, Xuanyu Wang, Yang Wang, Yanjie Wang, Yi Yang, Zijian Hu, Ziyi Yang, Zonghan Zhou, Binghao Qiang, Borui Zhang, Chenning Li, Enchang Zhang, Feifan Chen, Feng Jian, Fengyin Sun, Hao Qiu, Hao Zheng, Haoran Zhu, Hongyu Liu, Jianbin Deng, Jiaxin Song, Jiaying Chi, Jiayou Shi, Jie Fang, Jinghui Zhong, Jingyu Zhou, Jinze Li, Junfeng Yi, Junyan Yu, Junzhi Xue, Ni Song, Pengyi Chen, Qi Chen, Quansheng Li, Rui Tao, Shenghai Gong, Shenhang Lu, Tianqi Shen, Tianxiang Zhu, Tiehan Kang, Tingyu Li, Wendi Wu, Xiao Shen, Xiao Zhou, Xiaotao Zhang, Xinrong Li, Xuankun Yang, Xun Zhang, Yan Li, Ye Lu, Yi Wang, Yibo Zhou, Yichi Zhang, Yihao Sun, Yijun Huang, Yixin Zhu, Yixuan Wu, Yuchen Sun, Yue Wu, Yuheng Sun, Yukun Li, Yutian Tu, Yuxuan Qin, Yuzhuo Wu, Zeyu Li, Zhengyu Lou, Zhenning Ran, Zizhu He, Pengfei Liu

CoRR, May, 2026

Online Location Planning for AI-Defined Vehicles: Optimizing Joint Tasks of Order Serving and Spatio-Temporal Heterogeneous Model Fine-Tuning.

Bokeng Zheng, Bo Rao, Tianxiang Zhu, Chee-Wei Tan, Jingpu Duan, Zhi Zhou, Xu Chen, Xiaoxi Zhang

IEEE Trans. Mob. Comput., February, 2026

Efficient Warpage Simulation of Complex 2.5-D/3-D IC Structures with Novel Meshing Algorithm and Layerwise Plate Theory.

Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang

Proceedings of the Design, Automation & Test in Europe Conference, 2026

2025

ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC.

Qipan Wang, Tianxiang Zhu, Tianyu Jia, Yibo Lin, Runsheng Wang, Ru Huang

CoRR, November, 2025

High-Resolution Full-Chip Thermal Resistance Extraction of BEOL Interconnects in 3-D ICs Considering Detailed Via Connectivity.

Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC.

Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang

Proceedings of the Design, Automation & Test in Europe Conference, 2025

2024

Can You Do Both? Balancing Order Serving and Crowdsensing for Ride-Hailing Vehicles.

Bo Rao, Xiaoxi Zhang, Tianxiang Zhu, Yufei You, Yihong Li, Jingpu Duan, Zhi Zhou, Xu Chen

Proceedings of the 32nd IEEE/ACM International Symposium on Quality of Service, 2024

FaStTherm: Fast and Stable Full-Chip Transient Thermal Predictor Considering Nonlinear Effects.

Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

RACCOON: Online Content Recommendation and Edge-Assisted Caching for In-Vehicle Infotainment.

Yufei You, Xiaoxi Zhang, Tianxiang Zhu, Bo Rao, Yihong Li, Jingpu Duan, Lei Xue, Ennan Zhai, Xu Chen

Proceedings of the 10th International Conference on Big Data Computing and Communications, 2024

2023

Reliable fuzzy prognosability of decentralized fuzzy discrete-event systems and verification algorithm.

Tianxiang Zhu, Fuchun Liu, Cuntao Xiao

Inf. Sci., May, 2023

A Budget-aware Incentive Mechanism for Vehicle-to-Grid via Reinforcement Learning.

Tianxiang Zhu, Xiaoxi Zhang, Jingpu Duan, Zhi Zhou, Xu Chen

Proceedings of the 31st IEEE/ACM International Symposium on Quality of Service, 2023