Tingran Chen

According to our database, Tingran Chen authored at least 6 papers between 2022 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

STM-CIM: A 2427 TOPS/W Signed Compute-in-Memory with Analog-Domain Top-k and Matrix Transpose for CNN & Transformer.

Xiaoya Wang, Tingran Chen, Xinyi Zhang, Shuo Liang, Yimin Yang, Weijie Ding, Biao Pan

Proceedings of the IEEE International Symposium on Circuits and Systems, 2026

SuperCIM: A Charge-domain CIM with 3D Parallelism Reconfigurability based on Asynchronous NoC Protocol.

Yuxuan Ran, Tingran Chen, Bohan Xu, Biao Pan

Proceedings of the IEEE International Symposium on Circuits and Systems, 2026

2025

ACSNN: A 61.25 TOPS/W, 1.65 ns delay SNN Processor that combines CIM-inspired Synapse and Asynchronous Architecture.

Tingran Chen, Yi Zhao, Yuxuan Ran, Yueting Li, Wang Kang, Biao Pan

Proceedings of the IEEE International Symposium on Circuits and Systems, 2025

2024

PipeCIM: A High-Throughput Computing-In-Memory Microprocessor With Nested Pipeline and RISC-V Extended Instructions.

Tingran Chen, Wenjia Wang, Jiaqi Chen, Haotian Fu, Wente Yi, Bojun Cheng, He Zhang, Biao Pan

IEEE Trans. Circuits Syst. I Regul. Pap., July, 2024

DS-CIM: A 40nm Asynchronous Dual-Spike Driven, MRAM Compute-In-Memory Macro for Spiking Neural Network.

Haotian Fu, Yulong Huang, Tingran Chen, Chenyi Fu, Hongwei Ren, Yue Zhou, Shouzhong Peng, Zhirui Zong, Biao Pan, Bojun Cheng

IEEE Trans. Circuits Syst. I Regul. Pap., April, 2024

2022

CP-SRAM: charge-pulsation SRAM marco for ultra-high energy-efficiency computing-in-memory.

He Zhang, Linjun Jiang, Jianxin Wu, Tingran Chen, Junzhan Liu, Wang Kang, Weisheng Zhao

Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022