Toh-Ming Lu

According to our database, Toh-Ming Lu authored at least 5 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2018

Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness.

Sean P. Ogden, Yueming Xu, Kong Boon Yeap, Tian Shen, Toh-Ming Lu, Joel L. Plawsky

Microelectron. Reliab., 2018

2015

A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test.

Sean P. Ogden, Juan Borja, Huawei Zhou, Joel L. Plawsky, Toh-Ming Lu, William N. Gill

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2011

Bias-temperature stress of Al on porous low-k dielectrics.

Ming He, Huafang Li, Pei-I Wang, Toh-Ming Lu

Microelectron. Reliab., 2011

Study of metal adhesion on porous low-k dielectric using telephone cord buckling.

Ming He, C. Gaire, G.-C. Wang, Toh-Ming Lu

Microelectron. Reliab., 2011

2003

The measurement of the dielectric and optical properties of nano thin films by THz differential time-domain spectroscopy.

Kwang-Su Lee, Toh-Ming Lu, Xicheng Zhang

Microelectron. J., 2003