Sean P. Ogden

According to our database, Sean P. Ogden authored at least 5 papers between 2015 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime.

Lili Cheng, Seungman Choi, Sean P. Ogden, Teck Jung Tang, Robert Fox

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness.

Sean P. Ogden, Yueming Xu, Kong Boon Yeap, Tian Shen, Toh-Ming Lu, Joel L. Plawsky

Microelectron. Reliab., 2018

New insight on TDDB area scaling methodology of non-Poisson systems.

Tian Shen, Kong Boon Yeap, Sean P. Ogden, Cathryn Christiansen, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.

Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test.

Sean P. Ogden, Juan Borja, Huawei Zhou, Joel L. Plawsky, Toh-Ming Lu, William N. Gill

Proceedings of the IEEE International Reliability Physics Symposium, 2015