Kong Boon Yeap

According to our database, Kong Boon Yeap authored at least 6 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2018

Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness.

Sean P. Ogden, Yueming Xu, Kong Boon Yeap, Tian Shen, Toh-Ming Lu, Joel L. Plawsky

Microelectron. Reliab., 2018

New insight on TDDB area scaling methodology of non-Poisson systems.

Tian Shen, Kong Boon Yeap, Sean P. Ogden, Cathryn Christiansen, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.

Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

An investigation of process dependence of porous IMD TDDB.

Wenyi Zhang, M. C. Silvestre, A. Selvam, E. Ramanathan, C. Ordonio, J. Schaller, Tian Shen, Kong Boon Yeap, C. Capasso, Patrick Justison, J. H. Lee

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of electrode surface modulation on time-dependent dielectric breakdown.

Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2015

An investigation of dielectric thickness scaling on BEOL TDDB.

Tian Shen, Wenyi Zhang, Kong Boon Yeap, Jing Tan, Walter Yao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2015