Xuejun Fan

According to our database, Xuejun Fan authored at least 27 papers between 2004 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Group Key Exchange Protocols from Supersingular Isogenies.

Xuejun Fan, Xiu Xu, Bao Li

Proceedings of the Information Security and Cryptology - 16th International Conference, 2020

CSURF-TWO: CSIDH for the Ratio (2 : 1).

Xuejun Fan, Song Tian, Xiu Xu, Bao Li

Proceedings of the Information Security and Cryptology - 16th International Conference, 2020

2019

CSIDH on Other Form of Elliptic Curves.

Xuejun Fan, Song Tian, Bao Li, Xiu Xu

IACR Cryptol. ePrint Arch., 2019

A Reliability Prediction Methodology for LED Arrays.

Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang, Guohao Zhang

IEEE Access, 2019

Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.

Wei Chen, Jiajie Fan, Cheng Qian, Bin Pu, Xuejun Fan, Guoqi Zhang

IEEE Access, 2019

Speeding up Scalar Multiplication on Koblitz Curves Using \mu _4 Coordinates.

Weixuan Li, Wei Yu, Bao Li, Xuejun Fan

Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019

Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields.

Xuejun Fan, Song Tian, Bao Li, Weixuan Li

Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019

2018

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.

Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan

Sensors, 2018

A stochastic process based reliability prediction method for LED driver.

Bo Sun, Xuejun Fan, Willem D. van Driel, Chengqiang Cui, Guoqi Zhang

Reliab. Eng. Syst. Saf., 2018

A new hermetic sealing method for ceramic package using nanosilver sintering technology.

Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang

Microelectron. Reliab., 2018

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging.

Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark D. Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, Xuejun Fan

Microelectron. Reliab., 2018

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.

Jiajie Fan, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang

Microelectron. Reliab., 2018

2017

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.

Bo Sun, Xuejun Fan, Huaiyu Ye, Jiajie Fan, Cheng Qian, Willem D. van Driel, Guoqi Zhang

Reliab. Eng. Syst. Saf., 2017

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.

Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang

Microelectron. Reliab., 2017

Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method.

Cheng Qian, Yun Li, Jiajie Fan, Xuejun Fan, Jiajia Fu, Lixia Zhao, Guoqi Zhang

Microelectron. Reliab., 2017

Color shift acceleration on mid-power LED packages.

Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang

Microelectron. Reliab., 2017

Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages.

Jiajie Fan, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang

Microelectron. Reliab., 2017

Modeling nonlinear moisture diffusion in inhomogeneous media.

Liangbiao Chen, Jiang Zhou, Hsing-wei Chu, Guoqi Zhang, Xuejun Fan

Microelectron. Reliab., 2017

Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guoqi Zhang

IEEE Access, 2017

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method.

Cheng Qian, Jiajie Fan, Xuejun Fan, Guoqi Zhang

IEEE Access, 2017

2016

PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.

Bo Sun, Xuejun Fan, Cheng Qian, Guoqi Zhang

IEEE Trans. Ind. Electron., 2016

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.

Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang

Reliab. Eng. Syst. Saf., 2016

2015

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests.

Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang

Microelectron. Reliab., 2015

2012

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds.

Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, Darvin Edwards

Microelectron. Reliab., 2012

2010

Advances in Wafer Level Packaging (WLP).

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai

Microelectron. Reliab., 2010

Finite element modeling on electromigration of solder joints in wafer level packages.

Pridhvi Dandu, Xuejun Fan, Y. Liu, C. Diao

Microelectron. Reliab., 2010

2004

Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.

Xuejun Fan, Jiang Zhou, G. Q. Zhang

Microelectron. Reliab., 2004