Toshihiko Ochiai

According to our database1, Toshihiko Ochiai authored at least 2 papers in 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2013
Testability improvement for 12.8 GB/s Wide IO DRAM controller by small area pre-bonding TSV tests and a 1 GHz sampled fully digital noise monitor.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

High density and reliable packaging technology with Non Conductive Film for 3D/TSV.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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