Tsz-Bin Liu

According to our database, Tsz-Bin Liu authored at least 3 papers between 2021 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

7.1 A 212.5Gb/s DSP-Based PAM-4 Transceiver with 50dB Loss Compensation for Large AI System Interconnects in 4nm FinFET.

Ehung Chen, Henry Park, Mohammed Abdullatif, Miguel Gandara, Ahmed ElShater, Amr Khashaba, Shih-Hao Huang, Tsz-Bin Liu, Atharav Atharav, Joonyeong Lee, Qaiser Nehal, Mohamed Megahed, Yusang Chun, Cheng-En Shieh, Vidhan Jolly, SoonWon Kwon, Hsin-Ta Chien, Ke-Chung Wu, Cheng-En Liu, Peng Yan, Po-Jui Li, Chun-Han Chen, Tzu-Shun Lin, Pei-Chieh Liu, Tamer A. Ali

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2023

A 4.63pJ/b 112Gb/s DSP-Based PAM-4 Transceiver for a Large-Scale Switch in 5nm FinFET.

Henry Park, Mohammed Abdullatif, Ehung Chen, Ahmed Elmallah, Qaiser Nehal, Miguel Gandara, Tsz-Bin Liu, Amr Khashaba, Joonyeong Lee, Chih-Yi Kuan, Dhinessh Ramachandran, Ruey-Bo Sun, Atharav Atharav, Yusang Chun, Mantian Zhang, Deng-Fu Weng, Chung-Hsien Tsai, Chen-Hao Chang, Chia-Sheng Peng, Sheng-Tsung Hsu, Tamer A. Ali

Proceedings of the IEEE International Solid- State Circuits Conference, 2023

2021

11.1 A 1.7pJ/b 112Gb/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology.

Ramy Yousry, Ehung Chen, Yu-Ming Ying, Mohammed Abdullatif, Mohammad Elbadry, Ahmed ElShater, Tsz-Bin Liu, Joonyeong Lee, Dhinessh Ramachandran, Kaiz Wang, Chih-Hao Weng, Mau-Lin Wu, Tamer A. Ali

Proceedings of the IEEE International Solid-State Circuits Conference, 2021