W. C. Huang

According to our database, W. C. Huang authored at least 4 papers between 2005 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

BCB-to-oxide bonding technology for 3D integration.

S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen

Microelectron. Reliab., 2012

2011

Cu-based bonding technology for 3D integration applications.

Kuan-Neng Chen, Z. Xu, F. Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

On-board real time monitor for diesel engine vehicles.

Y. S. Shiao, C. C. Li, Chin E. Lin, C. C. Li, C. J. Sun, W. C. Huang, I. H. Lin

Proceedings of the 2009 Euro American conference on Telematics and Information Systems: New Opportunities to increase Digital Citizenship, 2009

2005

A flexible macroblock ordering with 3D MBAMAP for H.264/AVC.

Tokunbo Ogunfunmi, W. C. Huang

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005