Chuan-An Cheng

According to our database, Chuan-An Cheng authored at least 5 papers between 2010 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.

Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications.

Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Hsuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Ho-Ming Tong

IEEE Trans. Biomed. Circuits Syst., 2014

18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications.

Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-Lung Lin, Ho-Ming Tong

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2011

Cu-based bonding technology for 3D integration applications.

Kuan-Neng Chen, Z. Xu, F. Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Wafer-level 3D integration using hybrid bonding.

Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen

Proceedings of the IEEE International Conference on 3D System Integration, 2010