Xianping Chen

According to our database, Xianping Chen authored at least 14 papers between 2015 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

UB-Mesh: a Hierarchically Localized nD-FullMesh Datacenter Network Architecture.

Heng Liao, Bingyang Liu, Xianping Chen, Zhigang Guo, Chuanning Cheng, Jianbing Wang, Xiangyu Chen, Peng Dong, Rui Meng, Wenjie Liu, Zhe Zhou, Ziyang Zhang, Yuhang Gai, Cunle Qian, Yi Xiong, Zhongwu Cheng, Jing Xia, Yuli Ma, Xi Chen, Wenhua Du, Shizhong Xiao, Chungang Li, Yong Qin, Liudong Xiong, Zhou Yu, Lv Chen, Lei Chen, Buyun Wang, Pei Wu, Junen Gao, Xiaochu Li, Jian He, Shizhuan Yan, Bill McColl

CoRR, March, 2025

An investigation of how circuit parameters affect the short-circuit type 2 ruggedness in FS-IGBT.

Jingping Zhang, Houcai Luo, Huan Wu, Bofeng Zheng, Xianping Chen

Microelectron. J., 2025

UB-Mesh: A Hierarchically Localized nD-FullMesh Data Center Network Architecture.

Heng Liao, Bingyang Liu, Xianping Chen, Zhigang Guo, Chuanning Cheng, Jianbing Wang, Xiangyu Chen, Peng Dong, Rui Meng, Wenjie Liu, Zhe Zhou, Ziyang Zhang, Yuhang Gai, Cunle Qian, Yi Xiong, Zhongwu Cheng, Jing Xia, Yuli Ma, Xi Chen, Wenhua Du, Shizhong Xiao, Chungang Li, Yong Qin, Liudong Xiong, Zhou Yu, Lv Chen, Lei Chen, Buyun Wang, Pei Wu, Junen Gao, Xiaochu Li, Jian He, Shizhuan Yan, Bill McColl

IEEE Micro, 2025

Contact pressure monitoring of press-pack IGBT using ultrasonic reflection coefficient method.

Deshuai Sun, Xiao Wang, Houcai Luo, Dongfang Dai, Xianping Chen, Hui Li

IEICE Electron. Express, 2025

2024

Accurate current measurement method in high frequency hybrid switch test and application.

Peixuan Jiang, Bo Gao, Yuheng Gao, Jialu Wang, Xiao Wang, Ping Wang, Xianping Chen

IEICE Electron. Express, 2024

2023

Thermal Stress Analysis and Control Method for Surface Acoustic Wave Atomizer.

Xufeng Xue, Baile Cui, Xianping Chen, Wen Wang, Mingchen Sun, Yong Liang

Sensors, October, 2023

AFNFA: An Approach to Automate NCCL Configuration Exploration.

Zibo Wang, Yuhang Zhou, Chen Tian, Xiaoliang Wang, Xianping Chen

Proceedings of the 7th Asia-Pacific Workshop on Networking, 2023

2017

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.

Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang

Microelectron. Reliab., 2017

Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guoqi Zhang

IEEE Access, 2017

2016

Sorption and Diffusion of Water Vapor and Carbon Dioxide in Sulfonated Polyaniline as Chemical Sensing Materials.

Qiuhua Liang, Junke Jiang, Huaiyu Ye, Ning Yang, Miao Cai, Jing Xiao, Xianping Chen

Sensors, 2016

Effects of stress-loading test methods on the degradation of light-emitting diode modules.

Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen

Microelectron. Reliab., 2016

2015

Genetic Algorithm (GA)-Based Inclinometer Layout Optimization.

Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Dao-Guo Yang

Sensors, 2015

A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds.

Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang

Microelectron. Reliab., 2015

Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method.

Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang

Microelectron. Reliab., 2015