Dao-Guo Yang

According to our database, Dao-Guo Yang authored at least 27 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization.

Hengjian He, Miao Cai, Minghui Yun, Hao Chen, Huanhuan Wang, Dao-Guo Yang

IEEE Trans. Instrum. Meas., 2024

2021

Entropy-based analysis and classification of acute tonic pain from microwave transcranial signals obtained via the microwave-scattering approach.

Dao-Guo Yang, Daoshuang Geng, Lixia Zheng, Miao Cai, Weidong Hao

Biomed. Signal Process. Control., 2021

2020

A Novel Microwave Treatment for Sleep Disorders and Classification of Sleep Stages Using Multi-Scale Entropy.

Daoshuang Geng, Dao-Guo Yang, Miao Cai, Lixia Zheng

Entropy, 2020

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review.

Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Dao-Guo Yang, Guoqi Zhang

Entropy, 2020

Evaluation of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Using Multi-Entropy Machine Learning Approach.

Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao

IEEE Access, 2020

2019

Detection of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Obtained via the Microwave Scattering Approach.

Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao, Xiaoming Li

IEEE Access, 2019

Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs.

Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Dao-Guo Yang, Guoqi Zhang

IEEE Access, 2019

Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method.

Miao Cai, Zhi Liang, Kunmiao Tian, Minghui Yun, Ping Zhang, Dao-Guo Yang, Guoqi Zhang

IEEE Access, 2019

2018

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.

Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan

Sensors, 2018

2016

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.

Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang

Reliab. Eng. Syst. Saf., 2016

Effects of stress-loading test methods on the degradation of light-emitting diode modules.

Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen

Microelectron. Reliab., 2016

2015

Genetic Algorithm (GA)-Based Inclinometer Layout Optimization.

Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Dao-Guo Yang

Sensors, 2015

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests.

Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang

Microelectron. Reliab., 2015

A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds.

Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang

Microelectron. Reliab., 2015

Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method.

Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang

Microelectron. Reliab., 2015

2013

A novel soldering method to evaluate PCB pad cratering for pin-pull testing.

Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang

Microelectron. Reliab., 2013

2011

Effect of high temperature aging on reliability of automotive electronics.

Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria

Microelectron. Reliab., 2011

2010

Reliability modeling on a MOSFET power package based on embedded die technology.

Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel

Microelectron. Reliab., 2010

Designing for reliability using a new Wafer Level Package structure.

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman

Microelectron. Reliab., 2010

2008

On chip-package stress interaction.

W. D. van Driel, Dao-Guo Yang, G. Q. Zhang

Microelectron. Reliab., 2008

An Optimum Design Method for Nonlinear System Using an Improved Neural Network.

Miao Cai, Dao-Guo Yang, Wenbin Chen, Quan-Yong Li

Proceedings of the International Conference on Computer Science and Software Engineering, 2008

2007

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Novel shear tools for viscoelastic characterization of packaging polymers.

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers

Microelectron. Reliab., 2007

Mechanical reliability challenges for MEMS packages: Capping.

Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2007

2006

Reliability modelling for packages in flexible end-products.

W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang

Microelectron. Reliab., 2006

2004

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.

Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang

Microelectron. Reliab., 2004