Xiao Huo

According to our database, Xiao Huo authored at least 16 papers between 2003 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

Learned Point Cloud Attribute Compression With Cross-Scale Point Transformer and Geometry-Aware Context Prediction Entropy Model.

Xiao Huo, Wei Zhang, Fuzheng Yang

IEEE Trans. Circuits Syst. Video Technol., April, 2026

FusionCIM: Accelerating LLM Inference with Fusion-Driven Computing-in-Memory Architecture.

Zihao Xuan, Jia Chen, Yewen Li, Wei Xuan, Hegan Chen, Xiao Huo, Fengbin Tu

CoRR, April, 2026

D²CIM: A 28nm 53.3 TFLOPS/W Decoding Digital CIM Macro for Efficient FlashMLA-based LLM Inference.

Jia Chen, Zihao Xuan, Yewen Li, Zhuoya Yan, Zimu Li, Yat-Fong Yung, Yi Deng, Xiao Huo, Chi-Ying Tsui, Kwang-Ting Cheng, Fengbin Tu

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

2025

Rendering-Oriented 3D Point Cloud Attribute Compression Using Sparse Tensor-Based Transformer.

Xiao Huo, Junhui Hou, Shuai Wan, Fuzheng Yang

IEEE Trans. Circuits Syst. Video Technol., August, 2025

Entropy Modeling With Voxel Grouping and Cross-Group Attention for Point Cloud Geometry Compression.

Yimo Cao, Wei Zhang, Xiao Huo, Fuzheng Yang

IEEE Signal Process. Lett., 2025

CST-PCAC: Learned Point Cloud Attribute Compression with Cross-Scale Point Transformer.

Xiao Huo, Wei Zhang, Fuzheng Yang

Proceedings of the Data Compression Conference, 2025

2024

Light Field Rectification Based on Relative Pose Estimation.

Xiao Huo, Dongyang Jin, Saiping Zhang, Fuzheng Yang

IEEE Trans. Instrum. Meas., 2024

2023

AutoDCIM: An Automated Digital CIM Compiler.

Jia Chen, Fengbin Tu, Kunming Shao, Fengshi Tian, Xiao Huo, Chi-Ying Tsui, Kwang-Ting Cheng

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2021

Synchronous Weight Quantization-Compression for Low-Bit Quantized Neural Network.

Yuzhong Jiao, Sha Li, Xiao Huo, Yiu Kei Li

Proceedings of the International Joint Conference on Neural Networks, 2021

Unbalanced Encoding in Synchronous Weight Quantization-Compression for Low-Bit Quantized Neural Network.

Yuzhong Jiao, Sha Li, Peng Luo, Xiao Huo, Yiu Kei Li

Proceedings of the IEEE Global Conference on Artificial Intelligence and Internet of Things, 2021

2020

A Light Field Camera Calibration Method Using Sub-Aperture Related Bipartition Projection Model and 4D Corner Detection.

Dongyang Jin, Saiping Zhang, Xiao Huo, Wei Zhang, Fuzheng Yang

CoRR, 2020

A Corner Detection Method for Conventional Light Field Camera by Jointly Using Line-Features.

Dongyang Jin, Saiping Zhang, Xiao Huo, Fuzheng Yang

IEEE Access, 2020

Weight Compression-Friendly Binarized Neural Network.

Yuzhong Jiao, Xiao Huo, Yuan Lei, Sha Li, Yiu Kei Li

Proceedings of the IEEE Global Conference on Artificial Intelligence and Internet of Things, 2020

2019

NTIRE 2019 Challenge on Video Super-Resolution: Methods and Results.

Seungjun Nah, Radu Timofte, Shuhang Gu, Sungyong Baik, Seokil Hong, Gyeongsik Moon, Sanghyun Son, Kyoung Mu Lee, Xintao Wang, Kelvin C. K. Chan, Ke Yu, Chao Dong, Chen Change Loy, Yuchen Fan, Jiahui Yu, Ding Liu, Thomas S. Huang, Xiao Liu, Chao Li, Dongliang He, Yukang Ding, Shilei Wen, Fatih Porikli, Ratheesh Kalarot, Muhammad Haris, Greg Shakhnarovich, Norimichi Ukita, Peng Yi, Zhongyuan Wang, Kui Jiang, Junjun Jiang, Jiayi Ma, Hang Dong, Xinyi Zhang, Zhe Hu, Kwan-Young Kim, Dong Un Kang, Se Young Chun, Kuldeep Purohit, A. N. Rajagopalan, Yapeng Tian, Yulun Zhang, Yun Fu, Chenliang Xu, Ahmet Murat Tekalp, Mustafa Akin Yilmaz, Cansu Korkmaz, Manoj Sharma, Megh Makwana, Anuj Badhwar, Ajay Pratap Singh, Avinash Upadhyay, Rudrabha Mukhopadhyay, Ankit Shukla, Dheeraj Khanna, A. S. Mandal, Santanu Chaudhury, Si Miao, Yongxin Zhu, Xiao Huo

Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition Workshops, 2019

2016

Dr.seq: a quality control and analysis pipeline for droplet sequencing.

Xiao Huo, Sheng'en Hu, Chengchen Zhao, Yong Zhang

Bioinform., 2016

2003

Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology.

Xiao Huo, Guo-Wei Xiao, Kevin J. Chen, Philip C. H. Chan

Proceedings of the IEEE Custom Integrated Circuits Conference, 2003