Y. J. Su

According to our database, Y. J. Su authored at least 8 papers between 2003 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Tree identification using a distributed K-mean clustering algorithm.

Kuo-Tai Fan, Yu-Chang Tzeng, Y. F. Lin, Y. J. Su, Kun-Shan Chen

Proceedings of the IEEE International Geoscience & Remote Sensing Symposium, 2010

2009

A Parallel Differential Box Counting Algorithm Applied to Hyperspectral Image Classifications.

Yu-Chang Tzeng, Kuo-Tai Fan, Y. J. Su, Kun-Shan Chen

Proceedings of the IEEE International Geoscience & Remote Sensing Symposium, 2009

2005

A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections.

C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong

Microelectron. Reliab., 2005

Process improvement of 0.13mum Cu/Low K (Black Diamond^TM) dual damascene interconnection.

H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang

Microelectron. Reliab., 2005

2004

Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee

Microelectron. J., 2004

2003

Investigation of defect on copper bond pad surface in copper/low k process integration.

Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo

Microelectron. Reliab., 2003

Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration.

Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo

Microelectron. J., 2003

Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process.

C. F. Tsang, V. N. Bliznetsov, Y. J. Su

Microelectron. J., 2003