Yuki Miwa

According to our database, Yuki Miwa authored at least 2 papers in 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs.

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation.

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019