# Hisashi Kino

According to our database

Collaborative distances:

^{1}, Hisashi Kino authored at least 8 papers between 2009 and 2017.Collaborative distances:

## Timeline

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## Bibliography

2017

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current.

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip.

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

2016

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Micromachines, 2016

Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current.

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2016

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler.

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors.

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Proceedings of the IEEE International Conference on 3D System Integration, 2009