Zhiyuan Fu
Orcid: 0009-0008-6021-4170
According to our database1,
Zhiyuan Fu authored at least 14 papers
between 2023 and 2026.
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Bibliography
2026
CtxFuzz: Discovering heap-based memory vulnerabilities through context heap operation sequence guided fuzzing.
Sci. Comput. Program., 2026
Proceedings of the 33rd Annual Network and Distributed System Security Symposium, 2026
2025
FDLLM: A Text Fingerprint Detection Method for LLMs in Multi-Language, Multi-Domain Black-Box Environments.
CoRR, January, 2025
Predicting the Brain-To-Plasma Unbound Partition Coefficient of Compounds via Formula-Guided Network.
J. Chem. Inf. Model., 2025
Ferroelectric materials, devices, and chips technologies for advanced computing and memory applications: development and challenges.
Sci. China Inf. Sci., 2025
OSSDetector: Towards a More Accurate Approach for C/C++ Third-Party Library Detection.
Proceedings of the 24th IEEE International Conference on Trust, 2025
Proceedings of the 24th IEEE International Conference on Trust, 2025
MAAP: A Self-Evolving Multi-Agent Automated Vulnerability Repair Framework for Python.
Proceedings of the 32nd Asia-Pacific Software Engineering Conference, 2025
2024
Computation EE Fairness for a UAV-Enabled Wireless Powered MEC Network With Hybrid Passive and Active Transmissions.
IEEE Internet Things J., June, 2024
Local Scaffold Diversity-Contributed Generator for Discovering Potential NLRP3 Inhibitors.
J. Chem. Inf. Model., 2024
Research on Lifecycle-Driven Government Data Security Model and Data Grouping Technology.
Proceedings of the 23rd IEEE International Conference on Trust, 2024
Proceedings of the Formal Methods and Software Engineering, 2024
IMCE: An In-Memory Computing and Encrypting Hardware Architecture for Robust Edge Security.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2024
2023
New Insights into Read Current Margin and Memory Window of HfO2-based Ferroelectric FET with Re-exploration of the Role of Ferroelectric Dynamics and Interface Charges during Readout.
Proceedings of the 53rd IEEE European Solid-State Device Research Conference, 2023