Ahmad Hassan
Orcid: 0000-0002-2215-5375Affiliations:
- Polytechnique Montréal, Montréal, QC, Canada
According to our database1,
Ahmad Hassan authored at least 58 papers
between 2015 and 2026.
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Bibliography
2026
A 1.2-ns Delay Level Shifter Circuit Using Multiple Fast Charging, Discharging, and Feed-Forward Paths.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2026
A 150-Mbps Low-Latency Small-Size Fault Digital Isolation System in 180-nm CMOS Process for Aerospace Applications.
IEEE Trans. Aerosp. Electron. Syst., 2026
2025
A Compact High-Speed Capacitive Data Transfer Link With Common Mode Transient Rejection for Isolated Sensor Interfaces.
IEEE Trans. Very Large Scale Integr. Syst., August, 2025
Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies.
IEEE Access, 2025
A Tunable and Area-Efficient Delayed Fault Detection Circuit for Voltage Monitoring Systems with 10.19% Voltage Sensitivity.
Proceedings of the 23rd IEEE Interregional NEWCAS Conference, 2025
A Comparative Analysis of Off-Policy DRL Strategies for Analog Circuit Optimization: A Case Study on Bandgap References.
Proceedings of the 23rd IEEE Interregional NEWCAS Conference, 2025
Comparative Thermal Analysis of Single vs. Arrayed Layouts for Integrated Power Transistors Using COMSOL.
Proceedings of the 32nd IEEE International Conference on Electronics, Circuits and Systems, 2025
AI-Assisted Design of a Compact Voltage Monitoring System with a Millisecond-Delayed Fault Detection Circuit.
Proceedings of the 32nd IEEE International Conference on Electronics, Circuits and Systems, 2025
2024
A Low-Power 0.68-Gbps Data Communication System for Capacitive Digital Isolator With 1.9-ns Propagation Delay.
IEEE Trans. Very Large Scale Integr. Syst., May, 2024
Calibration of Ring Oscillator-Based Integrated Temperature Sensors for Power Management Systems.
Sensors, January, 2024
Novel Peak-Source-Scanning (NPSS) Model for Thermal Control of Systems-in-Package (SiP).
IEEE Access, 2024
Enhanced Dynamic Regulation in Buck Converters: Integrating Input-Voltage Feedforward With Voltage-Mode Feedback.
IEEE Access, 2024
Capacitively Isolated 400 Mbps Data Transfer System with 2 Ns Propagation Delay and 5 kV /µs Common Mode Transient Immunity.
Proceedings of the 22nd IEEE Interregional NEWCAS Conference, 2024
2023
Delay Mismatch Insensitive Dead Time Generator for High-Voltage Switched-Mode Power Amplifiers.
IEEE Trans. Circuits Syst. I Regul. Pap., April, 2023
High-Temperature Fully Integrated Wireless Monitoring Systems for Aerospace Applications.
Proceedings of the IEEE International Conference on Wireless for Space and Extreme Environments, 2023
2022
A Fully Integrated Low-Power Hall-Based Isolation Amplifier With IMR Greater Than 120 dB.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
An Active Dead-Time Control Circuit With Timing Elements for a 45-V Input 1-MHz Half-Bridge Converter.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
A 9.2-ns to 1-s Digitally Controlled Multituned Deadtime Optimization for Efficient GaN HEMT Power Converters.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
Sensors, 2022
Estimation of Broadband Time-Interleaved ADC's Impairments and Performance Using Only Single-Tone Measurements.
IEEE Access, 2022
A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source.
IEEE Access, 2022
A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges.
IEEE Access, 2022
Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters.
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
2021
IEEE Trans. Circuits Syst. I Regul. Pap., 2021
Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021
Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021
A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 µm CMOS for Industrial Sensor Interfaces.
Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021
Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs).
Proceedings of the 64th IEEE International Midwest Symposium on Circuits and Systems, 2021
A Reconfigurable Single-Supply Multiple-Level Down-Shifter for System-on-Chip Applications.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2021
Design and Analysis of Combined Input-Voltage Feedforward and PI Controllers for the Buck Converter.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2021
2020
Fully Integrated Digital GaN-Based LSK Demodulator for High-Temperature Applications.
IEEE Trans. Circuits Syst. II Express Briefs, 2020
Sensors, 2020
Proceedings of the 18th IEEE International New Circuits and Systems Conference, 2020
A 1.99-ns 0.5-pJ Wide Frequency Range Level Shifter With Closed-Loop Negative Feedback.
Proceedings of the 18th IEEE International New Circuits and Systems Conference, 2020
Towards GaN500-based High Temperature ICs: Characterization and Modeling up to 600°C.
Proceedings of the 18th IEEE International New Circuits and Systems Conference, 2020
Proceedings of the 18th IEEE International New Circuits and Systems Conference, 2020
Fully Integrated Dual-Channel Gate Driver and Area Efficient PID Compensator for Surge Tolerant Power Sensor Interface.
Proceedings of the 18th IEEE International New Circuits and Systems Conference, 2020
A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation.
Proceedings of the 63rd IEEE International Midwest Symposium on Circuits and Systems, 2020
A High Efficiency and Fast Response PLL Based Buck Converter: Implementation and Simulation.
Proceedings of the 11th IEEE Latin American Symposium on Circuits & Systems, 2020
Wide Dynamic Range Front-End Programmable Isolation Amplifier using Integrated CMOS Hall Effect Sensor.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
A Versatile Non-Overlapping Signal Generator for Efficient Power-Converters Operation.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
A Tunable CMOS Thyristor-Based Pulse Generator for Integrated Sensor Interface Applications.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
Self-Adjusting Deadtime Generator for High-Efficiency High-Voltage Switched-Mode Power Amplifiers.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
2019
Sensors, 2019
GaN-based LSK demodulators for wireless data receivers in high-temperature applications.
Microelectron. J., 2019
A Versatile SoC/SiP Sensor Interface for Industrial Applications: Design Considerations.
Proceedings of the 31st International Conference on Microelectronics, 2019
2018
Electronics and Packaging Intended for Emerging Harsh Environment Applications: A Review.
IEEE Trans. Very Large Scale Integr. Syst., 2018
Toward an Energy-Efficient High-Voltage Compliant Visual Intracortical Multichannel Stimulator.
IEEE Trans. Very Large Scale Integr. Syst., 2018
IEEE Access, 2018
GaN Integration Technology, an Ideal Candidate for High-Temperature Applications: A Review.
IEEE Access, 2018
High-Temperature Empirical Modeling for the I-V Characteristics of GaN150-Based HEMT.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018
High-Temperature Modeling of the I-V Characteristics of GaN150 HEMT Using Machine Learning Techniques.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018
2017
Proceedings of the 15th IEEE International New Circuits and Systems Conference, 2017
2016
Proceedings of the IEEE 7th Latin American Symposium on Circuits & Systems, 2016
Wireless power transfer through metallic barriers enclosing a harsh environment; feasibility and preliminary results.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016
2015
Ultra-low power CMOS voltage reference for high temperature applications up to 300°C.
Proceedings of the 2015 IEEE International Conference on Electronics, 2015
Spatial carrier position modulation based multichannel capacitive link for bioelectronic implants.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2015