Boris Vaisband

IEEE Trans. Very Large Scale Integr. Syst., March, 2023

CTT-Based Scalable Neuromorphic Architecture.

[BibT_eX]

[DOI]

Mousa Karimi

Ataollah Saeed Monir

Rezvan Mohammadrezaee

IEEE J. Emerg. Sel. Topics Circuits Syst., March, 2023

P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 36th IEEE International System-on-Chip Conference, 2023

Digital LIF Neuron for CTT-Based Neuromorphic Systems.

[BibT_eX]

[DOI]

Okyanus T. Gumus

Mousa Karimi

Proceedings of the Great Lakes Symposium on VLSI 2023, 2023

Statistical Weight Refresh System for CTT-Based Synaptic Arrays.

[BibT_eX]

[DOI]

Proceedings of the Great Lakes Symposium on VLSI 2023, 2023

Hybrid Obfuscation of Chiplet-Based Systems.

[BibT_eX]

[DOI]

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022

A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source.

[BibT_eX]

[DOI]

IEEE Access, 2022

Integrated Power Delivery Methodology for 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 23rd International Symposium on Quality Electronic Design, 2022

Power Delivery for Ultra-Large-Scale Applications on Si-IF.

[BibT_eX]

[DOI]

Anja Kroon

Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

2021

Power Delivery for Silicon Interconnect Fabric.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on Circuits and Systems, 2021

2020

Multi-Bit CNT TSV for 3-D ICs.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on Circuits and Systems, 2020

2019

Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems.

[BibT_eX]

[DOI]

SivaChandra Jangam

IBM J. Res. Dev., 2019

Communication Considerations for Silicon Interconnect Fabric.

[BibT_eX]

[DOI]

Proceedings of the 21st ACM/IEEE International Workshop on System Level Interconnect Prediction, 2019

Global and semi-global communication on Si-IF.

[BibT_eX]

[DOI]

Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip, 2019

Reliability Evaluation of Silicon Interconnect Fabric Technology.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems.

[BibT_eX]

[DOI]

Future Gener. Comput. Syst., 2018

Network on interconnect fabric.

[BibT_eX]

[DOI]

Adeel Ahmad Bajwa

Proceedings of the 19th International Symposium on Quality Electronic Design, 2018

2017

Hexagonal TSV Bundle Topology for 3-D ICs.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, 2017

Hybrid energy harvesting in 3-D IC IoT devices.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2016

Noise Coupling Models in Heterogeneous 3-D ICs.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2016

Layer ordering to minimize TSVs in heterogeneous 3-D ICs.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on Circuits and Systems, 2016

2015

Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits.

[BibT_eX]

[DOI]

Ioannis Savidis

IEEE Trans. Very Large Scale Integr. Syst., 2015

3-D floorplanning algorithm to minimize thermal interactions.

[BibT_eX]

[DOI]

Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

2014

Thermal conduction path analysis in 3-D ICs.

[BibT_eX]

[DOI]

Ioannis Savidis