Ahmed Lakhssassi

Orcid: 0000-0003-1781-3211

According to our database1, Ahmed Lakhssassi authored at least 36 papers between 2010 and 2024.

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Bibliography

2024
A Low-Power 0.68-Gbps Data Communication System for Capacitive Digital Isolator With 1.9-ns Propagation Delay.
IEEE Trans. Very Large Scale Integr. Syst., May, 2024

Efficient Thermal Management Strategies for 3D-SiP Architectures.
Proceedings of the 18th International Conference on Ubiquitous Information Management and Communication, 2024

2023
Secure Video Communication Using Multi-Equation Multi-Key Hybrid Cryptography.
Future Internet, 2023

A Novel Hybrid Multikey Cryptography Technique for Video Communication.
IEEE Access, 2023

Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).
Proceedings of the 17th International Conference on Ubiquitous Information Management and Communication, 2023

2022
A Simple Fiber Optic Temperature Sensor for Fire Detection in Hazardous Environment Based on Differential Time Rise/Decay Phosphorescence Response.
IEEE Trans. Instrum. Meas., 2022

Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC).
Sensors, 2022

Recognizing COVID-19 from chest X-ray images for people in rural and remote areas based on deep transfer learning model.
Multim. Tools Appl., 2022

Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters.
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022

Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM).
Proceedings of the International Conference on Microelectronics, 2022

2021
Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies.
Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021

A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 µm CMOS for Industrial Sensor Interfaces.
Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021

Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs).
Proceedings of the 64th IEEE International Midwest Symposium on Circuits and Systems, 2021

2020
A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces.
Sensors, 2020

A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation.
Proceedings of the 63rd IEEE International Midwest Symposium on Circuits and Systems, 2020

A Novel Wideband CPW-Fed Square Aperture Monopole Antenna with Inverted-L Grounded Strips for Wireless and Satellite Applications.
Proceedings of the 2nd IEEE International Conference on Electronics, 2020

2018
Verification of Medication Dispensing Using the Attentive Computer Vision Approach.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018

2017
Thermal cooling system development for LabPET II scanners by forced convection flow.
Proceedings of the 15th IEEE International New Circuits and Systems Conference, 2017

2016
Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera.
IEEE Trans. Circuits Syst. Video Technol., 2016

2015
Visual Attention-Guided Approach to Monitoring of Medication Dispensing Using Multi-location Feature Saliency Patterns.
Proceedings of the 2015 IEEE International Conference on Computer Vision Workshop, 2015

2014
Epilepsy seizure prediction using graph theory.
Proceedings of the IEEE 12th International New Circuits and Systems Conference, 2014

Bioheat transfer problems with spatial or transient heating on skin surface or inside biological bodies.
Proceedings of the 7th International Conference on Biomedical Engineering and Informatics, 2014

2013
Multi-Scale Segmentation of Forest Areas and Tree Detection in LiDAR Images by the Attentive Vision Method.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2013

A netlist pruning tool for an electronic system prototyping platform.
Proceedings of the IEEE 11th International New Circuits and Systems Conference, 2013

A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera.
Proceedings of the 8th International Symposium on Image and Signal Processing and Analysis, 2013

Transformation-invariant image descriptors for change monitoring based on multi-modality imagery.
Proceedings of the 2013 IEEE International Geoscience and Remote Sensing Symposium, 2013

2012
Setting Adaptive Spike Detection Threshold for Smoothed TEO Based on Robust Statistics Theory.
IEEE Trans. Biomed. Eng., 2012

SoC systems thermal monitoring using embedded sensor cells unit.
Proceedings of the 55th IEEE International Midwest Symposium on Circuits and Systems, 2012

Hierarchical multi-scale segmentation of LiDAR images in forest areas.
Proceedings of the 2012 IEEE International Geoscience and Remote Sensing Symposium, 2012

Model-based extraction of image area descriptors using a multi-scale attention operator.
Proceedings of the 21st International Conference on Pattern Recognition, 2012

2011
Spatiotemporal attention operator using isotropic contrast and regional homogeneity.
J. Electronic Imaging, 2011

Adaptive multi-scale segmentation of surface data using unsupervised learning of seed positions.
Eng. Appl. Artif. Intell., 2011

Visual Attention Mechanisms for Data-Driven Multi-Scale Descriptor Extraction in Images.
Proceedings of the Machine Learning and Data Mining in Pattern Recognition, 2011

2010
Transformation-invariant extraction of multi-location image features from remote sensing imagery.
Proceedings of the IEEE International Geoscience & Remote Sensing Symposium, 2010

Outlier-Resistant Dissimilarity Measure for Feature-based Image Matching.
Proceedings of the 20th International Conference on Pattern Recognition, 2010

Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit.
Proceedings of the 17th IEEE International Conference on Electronics, 2010


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