Hiroyuki Hashimoto

According to our database1, Hiroyuki Hashimoto authored at least 22 papers between 1995 and 2021.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2021
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2020
CVaR-constrained Stochastic Bidding Strategy for a Virtual Power Plant with Mobile Energy Storages.
Proceedings of the IEEE PES Innovative Smart Grid Technologies Europe, 2020

2019
Deep Reinforcement Learning for Joint Bidding and Pricing of Load Serving Entity.
IEEE Trans. Smart Grid, 2019

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018
AR-Marker/IMU Hybrid Navigation System for Tether-Powered UAV.
J. Robotics Mechatronics, 2018

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

A Proposal for a Relief Supply Matching System.
Proceedings of the 5th International Conference on Information and Communication Technologies for Disaster Management, 2018

2017
Three-level co-optimization model for generation scheduling of integrated energy and regulation market.
Proceedings of the 2017 IEEE Innovative Smart Grid Technologies - Asia, 2017

2016
Mitigating substation demand fluctuations using decoupled price schemes for demand response.
Proceedings of the 2016 IEEE Power & Energy Society Innovative Smart Grid Technologies Conference, 2016

New concept of TSV formation methodology using Directed Self-Assembly (DSA).
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Toward digital staining using stimulated Raman scattering and statistical machine learning.
Proceedings of the Medical Imaging 2014: Digital Pathology, 2014

2013
A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Examination of mitral regurgitation with a goat heart model for the development of intelligent artificial papillary muscle.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

2011
Adaptive three-dimensional wavelet analysis for denoising TOF-SIMS images: Toward digital staining of pathological specimens.
Proceedings of the 4th International Conference on Biomedical Engineering and Informatics, 2011

2003
Autonomous Flight Control System for Intelligent Aero-robot for Disaster Prevention.
J. Robotics Mechatronics, 2003

1996
Fault tolerant subcube allocation in hypercube.
Proceedings of the 1996 International Symposium on Parallel Architectures, 1996

1995
The maximum dimensional fault-free subcube allocatable in faulty hypercube.
Proceedings of the 4th International Conference on Computer Communications and Networks (ICCCN '95), 1995


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