Arvind Anumula Paramanandam

According to our database, Arvind Anumula Paramanandam authored at least 3 papers between 2014 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

9.4 A 2×2 WLAN and Bluetooth combo SoC in 28nm CMOS with on-chip WLAN digital power amplifier, integrated 2G/BT SP3T switch and BT pulling cancelation.

Renaldi Winoto, Ashkan Olyaei, Mohammad Hajirostam, Wai Lau, Xiang Gao, Arnab Mitra, Ovidiu Carnu, Philip Godoy, Luns Tee, Hao Li, Erdem Erdogan, Alden Wong, Qiang Zhu, Timothy Loo, Fan Zhang, Liwei Sheng, Donghong Cui, Anuranjan Jha, Xiang Li, Wanghua Wu, Kun-Seok Lee, Derek Cheung, Ka Wo Pang, Haisong Wang, Jiexi Liu, Xingliang Zhao, Daibashish Gangopadhyay, David Cousinard, Arvind Anumula Paramanandam, Xiaoang Li, Norman Liu, Weiwei Xu, Yuan Fang, Xiaoyue Wang, Randy Tsang, Li Lin

Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016

2015

9.4 A 28nm CMOS digital fractional-N PLL with -245.5dB FOM and a frequency tripler for 802.11abgn/ac radio.

Xiang Gao, Luns Tee, Wanghua Wu, Kun-Seok Lee, Arvind Anumula Paramanandam, Anuranjan Jha, Norman Liu, Edwin Chan, Li Lin

Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

2014

20.5 A 40nm dual-band 3-stream 802.11a/b/g/n/ac MIMO WLAN SoC with 1.1Gb/s over-the-air throughput.

Ming He, Renaldi Winoto, Xiang Gao, Wayne Loeb, David Signoff, Wai Lau, Yuan Lu, Donghong Cui, Kun-Seok Lee, Sai-Wang Tam, Philip Godoy, Yung Chen, Sanghoon Joo, Changhui Hu, Arvind Anumula Paramanandam, Xiaoyue Wang, Chi-Hung Lin, Li Lin

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014