Philip Godoy

According to our database, Philip Godoy authored at least 3 papers between 2014 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

13.7 A 0.23mm² digital power amplifier with hybrid time/amplitude control achieving 22.5dBm at 28% PAE for 802.11g.

David Cousinard, Renaldi Winoto, Hao Li, Yuan Fang, Amir Ghaffari, Ashkan Olyaei, Ovidiu Carnu, Philip Godoy, Alden Wong, Xingliang Zhao, Jiexi Liu, Arnab Mitra, Randy Tsang, Li Lin

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2016

9.4 A 2×2 WLAN and Bluetooth combo SoC in 28nm CMOS with on-chip WLAN digital power amplifier, integrated 2G/BT SP3T switch and BT pulling cancelation.

Renaldi Winoto, Ashkan Olyaei, Mohammad Hajirostam, Wai Lau, Xiang Gao, Arnab Mitra, Ovidiu Carnu, Philip Godoy, Luns Tee, Hao Li, Erdem Erdogan, Alden Wong, Qiang Zhu, Timothy Loo, Fan Zhang, Liwei Sheng, Donghong Cui, Anuranjan Jha, Xiang Li, Wanghua Wu, Kun-Seok Lee, Derek Cheung, Ka Wo Pang, Haisong Wang, Jiexi Liu, Xingliang Zhao, Daibashish Gangopadhyay, David Cousinard, Arvind Anumula Paramanandam, Xiaoang Li, Norman Liu, Weiwei Xu, Yuan Fang, Xiaoyue Wang, Randy Tsang, Li Lin

Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016

2014

20.5 A 40nm dual-band 3-stream 802.11a/b/g/n/ac MIMO WLAN SoC with 1.1Gb/s over-the-air throughput.

Ming He, Renaldi Winoto, Xiang Gao, Wayne Loeb, David Signoff, Wai Lau, Yuan Lu, Donghong Cui, Kun-Seok Lee, Sai-Wang Tam, Philip Godoy, Yung Chen, Sanghoon Joo, Changhui Hu, Arvind Anumula Paramanandam, Xiaoyue Wang, Chi-Hung Lin, Li Lin

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014