Braden E. Desman

According to our database, Braden E. Desman authored at least 3 papers between 2025 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm² SoC and bySPI Chiplets for Wearable Computing.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

IEEE J. Solid State Circuits, January, 2026

2025

37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm² SoC and bySPI Chiplets.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems.

Zhenghong Chen, Braden E. Desman, Anjali Agrawal, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2025