Fahim Foysal

According to our database, Fahim Foysal authored at least 4 papers between 2025 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm² SoC and bySPI Chiplets for Wearable Computing.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

IEEE J. Solid State Circuits, January, 2026

2025

A Compact, Power-Efficient, and On-the-Fly I2C-to-SPI Converter for Distributed E-Textile Systems.

Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Jinhua Wang, Daniel S. Truesdell, Benton H. Calhoun

IEEE Trans. Circuits Syst. I Regul. Pap., December, 2025

37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm² SoC and bySPI Chiplets.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications.

Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Symposium on Circuits and Systems, 2025