Zhenghong Chen

According to our database, Zhenghong Chen authored at least 13 papers between 2014 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm² SoC and bySPI Chiplets for Wearable Computing.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

IEEE J. Solid State Circuits, January, 2026

A 93% Peak Efficiency Buck Converter Enabling Operation with Variable Embroidered Yarn Inductance for Battery Powered In-textile Systems.

Akiyoshi Tanaka, Zhenghong Chen, Jim Owens, Will Farrell, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

THReaD: A 22.8 Mbps/node Two-dimensional Hierarchical Reconfigurable and Distributed Network for E-textiles with Fault Tolerance and Cooperative Power Management.

Zhenghong Chen, Anjali Agrawal, Akiyoshi Tanaka, Trenton Elliott, Thomas Farrell, Zane Lewis, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

2025

A Compact, Power-Efficient, and On-the-Fly I2C-to-SPI Converter for Distributed E-Textile Systems.

Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Jinhua Wang, Daniel S. Truesdell, Benton H. Calhoun

IEEE Trans. Circuits Syst. I Regul. Pap., December, 2025

Energy-saving transmission time and power management for D2D connection with a relay node using the same band with a cellular connection.

Xian Jiang, Yiyao Zhu, Zitian Zhang, Zhenghong Chen, Bin Zhuge, Ligang Dong, Yipin Wang, Yingqi Sun, Jie Zhang

J. Supercomput., July, 2025

37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm² SoC and bySPI Chiplets.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications.

Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Symposium on Circuits and Systems, 2025

ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems.

Zhenghong Chen, Braden E. Desman, Anjali Agrawal, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2025

2024

Does Urban Polycentric Structure Improve Carbon Emission Efficiency? A Spatial Panel Data Analysis of 279 Cities in China from 2012 to 2020.

Shihan Zhang, Yanxin Xue, Shuzhen Jin, Zhenghong Chen, Suiying Cheng, Wei Wang

ISPRS Int. J. Geo Inf., 2024

2023

A 1pJ/bit Bypass-SPI Interconnect Bus with I²C Conversion Capability and 2.3nW Standby Power for Fabric Sensing Networks.

Xinjian Liu, Zhenghong Chen, Nugaira Gahan Mim, Anjali Agrawal, Benton H. Calhoun

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2023

2015

Generic regular decompositions for parametric polynomial systems.

Zhenghong Chen, Xiaoxian Tang, Bican Xia

J. Syst. Sci. Complex., 2015

2014

Generic regular decompositions for generic zero-dimensional systems.

Xiaoxian Tang, Zhenghong Chen, Bican Xia

Sci. China Inf. Sci., 2014

Hierarchical Comprehensive Triangular Decomposition.

Zhenghong Chen, Xiaoxian Tang, Bican Xia

Proceedings of the Mathematical Software - ICMS 2014, 2014