Will Farrell

According to our database, Will Farrell authored at least 5 papers between 2025 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm² SoC and bySPI Chiplets for Wearable Computing.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

IEEE J. Solid State Circuits, January, 2026

A 93% Peak Efficiency Buck Converter Enabling Operation with Variable Embroidered Yarn Inductance for Battery Powered In-textile Systems.

Akiyoshi Tanaka, Zhenghong Chen, Jim Owens, Will Farrell, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

THReaD: A 22.8 Mbps/node Two-dimensional Hierarchical Reconfigurable and Distributed Network for E-textiles with Fault Tolerance and Cooperative Power Management.

Zhenghong Chen, Anjali Agrawal, Akiyoshi Tanaka, Trenton Elliott, Thomas Farrell, Zane Lewis, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

2025

37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm² SoC and bySPI Chiplets.

Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems.

Zhenghong Chen, Braden E. Desman, Anjali Agrawal, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Proceedings of the IEEE Custom Integrated Circuits Conference, 2025