Antonio La Manna

According to our database, Antonio La Manna authored at least 7 papers between 2011 and 2015.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2015

Active-lite interposer for 2.5 & 3D integration.

Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean

Proceedings of the Symposium on VLSI Circuits, 2015

Processing active devices on Si interposer and impact on cost.

Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

3D stacking using ultra thin dies.

Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

3D stacking using Cu-Cu direct bonding.

Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-tier diagnosis of power domains in 3D TSV ICs.

Yuuki Araga, Makoto Nagata, Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Youssef Travaly, Michael Libois, Antonio La Manna, Wenqi Zhang, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011