Antonio La Manna

According to our database1, Antonio La Manna authored at least 7 papers between 2011 and 2015.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2015

Processing active devices on Si interposer and impact on cost.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2012
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
3D stacking using ultra thin dies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

3D stacking using Cu-Cu direct bonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-tier diagnosis of power domains in 3D TSV ICs.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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