Kenneth J. Rebibis

Affiliations:
  • IMEC, Leuven, Belgium


According to our database1, Kenneth J. Rebibis authored at least 6 papers between 2011 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016
Extreme wafer thinning optimization for via-last applications.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Die to wafer 3D stacking for below 10um pitch microbumps.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2012
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
3D stacking using ultra thin dies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

3D stacking using Cu-Cu direct bonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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