Dexin Wen

According to our database, Dexin Wen authored at least 2 papers between 2024 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory.

Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024

FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer.

Bo Jiao, Lei Xu, Xinyu Yu, Haitao Yang, Haozhe Zhu, Yu Wang, Jundong Zhu, Dexin Wen, Lingli Wang, Jun Tao, Chixiao Chen, Yinhe Han, Qi Liu, Ninghui Sun, Ming Liu

IEEE Trans. Circuits Syst. I Regul. Pap., September, 2024