Mochen Tian

According to our database, Mochen Tian authored at least 2 papers between 2025 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

SHINSAI: A 586 mm² Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory.

Haozhe Zhu, Bo Jiao, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Zexing Chen, Liyu Lin, Xuanda Lin, Suchang Huang, Mochen Tian, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

IEEE J. Solid State Circuits, January, 2026

2025

37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory.

Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2025