Dexin Wen

According to our database, Dexin Wen authored at least 3 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

SHINSAI: A 586 mm² Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory.

Haozhe Zhu, Bo Jiao, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Zexing Chen, Liyu Lin, Xuanda Lin, Suchang Huang, Mochen Tian, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

IEEE J. Solid State Circuits, January, 2026

2025

37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory.

Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024

FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer.

Bo Jiao, Lei Xu, Xinyu Yu, Haitao Yang, Haozhe Zhu, Yu Wang, Jundong Zhu, Dexin Wen, Lingli Wang, Jun Tao, Chixiao Chen, Yinhe Han, Qi Liu, Ninghui Sun, Ming Liu

IEEE Trans. Circuits Syst. I Regul. Pap., September, 2024