Siyao Jia

According to our database, Siyao Jia authored at least 4 papers between 2022 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

SHINSAI: A 586 mm² Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory.

Haozhe Zhu, Bo Jiao, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Zexing Chen, Liyu Lin, Xuanda Lin, Suchang Huang, Mochen Tian, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

IEEE J. Solid State Circuits, January, 2026

2025

37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory.

Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

EIGEN: Enabling Efficient 3DIC Interconnect with Heterogeneous Dual-Layer Network-on-Active-Interposer.

Siyao Jia, Bo Jiao, Haozhe Zhu, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Symposium on High Performance Computer Architecture, 2025

2022

Sensorless Control of PMSM With State Estimation PLL Base on Injection of High Frequency Rectangular Signal into Stationary Reference Frame.

Qinghao Wang, Siyao Jia, Yan Hong, Feng Ju

Proceedings of the 2nd International Conference on Control and Intelligent Robotics, 2022