Didier Landru

According to our database1, Didier Landru authored at least 3 papers in 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2010
Pre bonding metrology solutions for 3D integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


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