Ionut Radu

According to our database, Ionut Radu authored at least 7 papers between 2010 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

Multi-Gate FD-SOI Single Electron Transistor for hybrid SET-MOSFET quantum computing.

Fabio Bersano, Franco De Palma, Fabian Oppliger, Floris Braakman, Ionut Radu, Pasquale Scarlino, Martino Poggio, Adrian Mihai Ionescu

Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022

2015

3D monolithic integration: Stacking technology and applications.

Ionut Radu, Bich-Yen Nguyen, Gweltaz Gaudin, Carlos Mazure

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2013

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration.

Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio

Proceedings of 2013 International Conference on IC Design & Technology, 2013

Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013

2010

Pre bonding metrology solutions for 3D integration.

Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.

Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon

Proceedings of the IEEE International Conference on 3D System Integration, 2010