C. Euvrard

According to our database, C. Euvrard authored at least 3 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Use of optical metrology for wafer level packaging of CMOS image sensor.

D. Le Cunff, A. Pravdivtsev, K. Le Chao, C. Euvrard, Emilie Deloffre, A. Cailean

Proceedings of the IEEE International Conference on 3D System Integration, 2010