Jérôme Dechamp

According to our database, Jérôme Dechamp authored at least 4 papers between 2009 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009