Laurent Clavelier

According to our database1, Laurent Clavelier authored at least 3 papers between 2009 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2012
Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body.
Microelectron. Reliab., 2012

2010
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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