Erfan Azarkhish

Orcid: 0000-0003-4934-0332

According to our database1, Erfan Azarkhish authored at least 14 papers between 2013 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2022
A Construction Kit for Efficient Low Power Neural Network Accelerator Designs.
ACM Trans. Embed. Comput. Syst., September, 2022

2021
A Sub-mW Dual-Engine ML Inference System-on-Chip for Complete End-to-End Face-Analysis at the Edge.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

Single-Battery Cooperative Sensors For Multi-Lead Long Term Ambulatory ECG Measurement.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, BioCAS 2021, 2021

2019
A 20 Channel EMG SoC with an Integrated 32b RISC Core for Real-Time Wireless Prosthetic Control.
Proceedings of the 45th IEEE European Solid State Circuits Conference, 2019

2018
Neurostream: Scalable and Energy Efficient Deep Learning with Smart Memory Cubes.
IEEE Trans. Parallel Distributed Syst., 2018

2017
Logic-Base Interconnect Design for Near Memory Computing in the Smart Memory Cube.
IEEE Trans. Very Large Scale Integr. Syst., 2017

A Hybrid Instruction Prefetching Mechanism for Ultra Low-Power Multicore Clusters.
IEEE Embed. Syst. Lett., 2017

2016
Memory Hierarchy Design for Next Generation Scalable Many-core Platforms.
PhD thesis, 2016

Design and Evaluation of a Processing-in-Memory Architecture for the Smart Memory Cube.
Proceedings of the Architecture of Computing Systems - ARCS 2016, 2016

2015
A Modular Shared L2 Memory Design for 3-D Integration.
IEEE Trans. Very Large Scale Integr. Syst., 2015

High performance AXI-4.0 based interconnect for extensible smart memory cubes.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

2013
A case for three-dimensional stacking of tightly coupled data memories over multi-core clusters using low-latency interconnects.
IET Comput. Digit. Tech., 2013

3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters.
Proceedings of the 2013 Seventh IEEE/ACM International Symposium on Networks-on-Chip (NoCS), 2013

A high-performance multiported L2 memory IP for scalable three-dimensional integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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